PCB Assembly Capability

Max. PCB Size

600*1200mm

Min. PCB Thickness

0.35mm(13.8mil)

Min. IC Pitch

0.30mm(12mil)

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

BGA Ball Pitch

1mm ~ 3mm(4mil ~ 12mil)

BGA Ball Diameter

0.4mm ~ 1mm(16mil ~ 40mil)

QFP Lead Pitch

0.3mm ~ 2.54mm(15mil ~ 100mil)

Min Components size

0201

Standard chip size componen

0603 and larger

Assembly Surface finishing

Lead Free HAL,Immersion gold, OSP

PCBA material

FR-4,Aluminum,Rigid-Flex PCB,Flex,Super-thin PCB,Gold finger

Package

Anti-static Bubble Bag & Carton