PCB Manufacturing Capability

ITEM

Technical Specification

Standard

Advanced

Maximum Layer

1L-16L

1L-32L

Surface   Treatment

HASL-LF,OSP,Immersion Gold,Immersion Tin,Immersion Ag,Hard gold,gold fingers,

HASL-LF,OSP,Immersion Gold,Immersion Tin,Immersion Ag,Hard gold,gold fingers,

Board Type

Rigid PCB, FLEX PCB, Rigid-Flex PCB,Aluminum PCB

Rigid PCB, FLEX PCB, Rigid-Flex PCB,Aluminum PCB

Finished  Board Thickness

0.3-3.2MM

0.2-3.2MM

Minimum Line Width/Spacing

3MIL/3MIL(0.075MM)

2MIL/2MIL(0.05MM)

Minimum Hole Diameter

6MIL(0.15MM)

6MIL(0.1MM)

Minimum Solder Resist Opening (Single-Side)

1.5MIL(0.0375MM)

1.2MIL(0.03MM)

Minimum Solder Resist Bridge

3MIL(0.075MM)

2.2MIL(0.055MM)

Maximum   Aspect   Ratio (Thickness/Hole Diameter)

10:1

8:1

Impedance Control Accuracy

+/-7%

+/-5%

Maximum Board Size

630MM*620MM

630MM*620MM

Maximum Finished Copper Thickness

6OZ(210UM)

6OZ(210UM)

Minimum Board Thickness

6MIL(0.15MM)

3MIL（0.076MM）

Solder Mask Color

Red, Black, White, Yellow, Bule, Green

Red, Black, White, Yellow, Bule, Green

HDI PCB

3+N+3

4+N+4

Special Technology

HDI PCB,Bling/Burried holes,Contersink holes, Half holes,Carbon ink,Impedance control,Heavy copper PCB

HDI PCB,Bling/Burried holes,Contersink holes, Half holes,Carbon ink,Impedance control,Heavy copper PCB

Outline Profile

POUNCH and CNC

POUNCH and CNC